Hidden joints limit visual inspection. Review package warpage, solder volume and thermal mass with the process engineer; inspection acceptance should match the product requirement.
Plan hidden-joint inspection and thermal processing
Use the requirements below to prepare a focused project review. Confirm the work scope, acceptance criteria and responsibility for engineering changes in writing before production is released.
Information to include in your RFQ
- Ball pitch, package type and pad design
- Stencil and reflow requirements
- X-ray criteria and rework restrictions
Compare proposals on the same scope
Separate recurring unit cost from tooling, setup and test-development charges. Check what is included in inspection, traceability, packaging and disposition of nonconforming units. Ask which assumptions could change the quoted price or schedule.
Capability confirmation
[NEEDS CLIENT INPUT]: approved process capabilities, equipment, certificates, MOQ and available production lead times for this service.
These requirements describe a purchasing and engineering review, not a verified statement of factory capability.