Composition and Structure of Copper Clad Laminate Copper Foil Layer The copper foil layer in CCL is typically made of high-purity, electrodeposited copper. The thickness[…]
Introduction to Controlled Impedance Controlled impedance is a crucial concept in the realm of electronics and Electrical Engineering. It refers to the precise management of[…]
Introduction to Rigid-flex PCB Rigid-flex PCBs are a hybrid design that combines the benefits of both rigid and flexible printed circuit boards. This innovative technology[…]
What is PCB Layer Stack Up? A PCB (Printed Circuit Board) layer stack up refers to the arrangement of copper layers and insulating materials that[…]
Understanding the Track-Darkening Phenomenon When working with audio or video editing software, you may have encountered a peculiar issue where the background of your project[…]
Understanding Decals in SolidWorks Before we dive into the techniques for improving decal quality, let’s first understand what decals are and how they work in[…]
Understanding PCB Boundary Selection PCB (Printed Circuit Board) design involves placing various components and objects within a defined boundary. The PCB boundary represents the physical[…]
Understanding the Altium Infrastructure Server Before diving into troubleshooting, it’s important to understand what the Altium Infrastructure Server is and how it fits into your[…]
Introduction to Flex-Rigid Routing Flex-rigid routing refers to the process of creating electrical connections between flexible and rigid regions on a printed circuit board (PCB).[…]
Introduction to Polyregion-Pad Clearance When designing multilayer printed circuit boards (PCBs), it’s critical to maintain proper clearance between copper areas on different layers to avoid[…]