ROGERS PCB APPLICATIONS

What are Rogers PCB Materials Used For?

Rogers Corporation produces a wide range of high-performance printed circuit board (PCB) materials engineered for demanding applications. Rogers’ PCB Laminates offer superior electrical properties, thermal management, and mechanical stability for use in:

High-frequency RF/microwave circuits
Antenna and radar systems
5G wireless infrastructure
Aerospace and defense electronics
Automotive radar and sensors
High-power industrial controls
Medical equipment

Rogers’ innovative PCB materials enable the design of compact, reliable electronic systems that can withstand harsh environmental conditions. The unique properties of Rogers’ laminates make them ideal for applications requiring:

Low dielectric loss for high signal integrity
Consistent electrical performance over temperature
Controlled impedance for impedance matching
Excellent thermal conductivity for heat dissipation
Dimensional stability for fine-line circuitry
UL 94 V-0 flame retardancy

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Popular Rogers PCB Material Product Lines

RO3000 Series Laminates

RO3000 series high-frequency circuit materials are ceramic-filled PTFE composites designed for commercial RF/microwave applications. They offer:

Dielectric constants from 3.0 to 6.15
Dissipation factors as low as 0.0009
Consistent properties up to 77 GHz

Material	Dielectric Constant	Dissipation Factor @ 10 GHz
RO3003	3.00	0.0010
RO3006	6.15	0.0020
RO3010	10.2	0.0023

RO4000 Series Laminates

RO4000 series hydrocarbon ceramic laminates provide a cost-effective FR-4 alternative for high-volume wireless electronics production. Benefits include:

Dielectric constants from 2.55 to 6.15
Low Z-axis CTE for reliable plated through holes
CAF resistant with lead-free assembly

Material	Dielectric Constant	Dissipation Factor @ 2.5 GHz
RO4003C	3.38	0.0027
RO4350B	3.48	0.0037
RO4360G2	6.15	0.0038

RT/duroid Laminates

RT/duroid® microwave laminates are PTFE-based composites reinforced with glass microfibers for military and space applications. Key properties:

Extremely low dissipation factors (0.001-0.002)
Excellent dielectric constant tolerance (<0.02)
Resistant to out-gassing in vacuum

Material	Dielectric Constant	Dissipation Factor @ 10 GHz
RT/duroid 5870	2.33	0.0012
RT/duroid 5880	2.20	0.0009
RT/duroid 6002	2.94	0.0012

High-Frequency PCB Design Considerations

Designing PCBs for RF/microwave frequencies requires careful material selection and layout techniques to maintain signal integrity. Key considerations include:

Moisture Absorption

PTFE-based laminates like RO3000 and RT/duroid have very low moisture absorption compared to FR-4, minimizing the change in dielectric constant that can detune circuits.

Coefficient of Thermal Expansion (CTE)

Mismatches in the X-Y and Z-axis CTE of the dielectric and copper cladding can cause warping or interfacial failures during assembly. RO4000 laminates have a low Z-axis expansion for reliable plated through holes.

Thermal Management

High-power circuits generate significant heat that must be dissipated to avoid performance degradation. RT/duroid 6035HTC combines low loss with a high thermal conductivity of 1.44 W/m·K for effective cooling.

Controlled Impedance

Maintaining a constant impedance is critical for impedance matching and minimizing signal reflections. Rogers’ laminates have a tight dielectric constant control for consistent impedance across the board.

Insertion Loss

Insertion loss increases with frequency due to dielectric loss and conductor effects. Using low-loss materials like RO3000 and RT/duroid minimizes insertion loss for longer transmission distances.

Fabrication Guidelines for Rogers PCBs

Fabricating PCBs with Rogers’ materials requires specialized processes and equipment compared to standard FR-4. Some key guidelines:

Use recommended drill parameters and entry/exit materials to avoid delamination or burrs
Pretreat the PTFE surface with sodium etch prior to solder mask application
Select compatible adhesives and soldermasks rated for high temperatures
Follow the press cycle recommendations for optimal flow and cure of the resin system
Use a plasma or chemical treatment to prepare the PTFE surface for assembly

Working closely with a PCB fabricator experienced in processing Rogers’ materials is essential to ensure a successful manufacturing outcome.

Industry Applications for Rogers PCBs

Wireless Infrastructure

5G wireless networks rely on phased array antennas and massive MIMO systems operating in the 24-40 GHz mmWave bands. Rogers’ low-loss laminates enable the design of high-gain, multi-layer antenna boards with beam steering capabilities.

Automotive Radar

Advanced driver assistance systems (ADAS) use 77 GHz radar for collision avoidance and autonomous driving functions. RO3003 laminates offer a stable dielectric constant of 3.0 and low loss for compact, high-resolution radar modules.

Aerospace & Defense

Military radar and electronic warfare systems require PCB materials that can withstand extreme temperatures, shocks, and vibrations. RT/duroid laminates provide exceptional electrical and mechanical stability for mission-critical aerospace applications.

Medical Electronics

MRI and X-ray imaging systems operate at high voltages and frequencies, demanding low-loss PCB materials with high voltage breakdown strength. RO4000 series laminates meet the cost, performance, and reliability requirements for medical equipment.

Frequently Asked Questions (FAQ)

1. How do I select the right Rogers PCB material for my application?

Choosing the optimal Rogers PCB material depends on your specific application requirements, such as:

Operating frequency and bandwidth
Dielectric constant and loss tangent
Thermal conductivity and stability
Mechanical strength and stiffness
Cost and availability

Consult the Rogers product selection guide or contact their technical support team for assistance in material selection.

2. Can I use standard FR-4 fabrication processes for Rogers PCBs?

While some Rogers PCB materials may be compatible with conventional FR-4 fabrication processes, others require specialized techniques, such as:

Laser or plasma drilling for small vias
Sodium etch pretreatment for PTFE laminates
High-temperature press cycles for hydrocarbon ceramics
Plasma treatment for improved copper adhesion

It is recommended to work with a PCB fabricator experienced in handling Rogers materials to ensure the best results.

3. What are the lead times and minimum order quantities for Rogers PCBs?

Lead times and minimum order quantities (MOQs) for Rogers PCBs vary depending on the material type, thickness, and copper cladding specified. Some standard materials and configurations are available from distributors with short lead times and low MOQs. Custom laminates may require longer lead times and higher MOQs due to the special manufacturing processes involved. Check with your PCB supplier for current availability and pricing.

4. How do I manage the thermal expansion mismatch between Rogers laminates and copper?

Rogers PCB materials have different coefficients of thermal expansion (CTE) compared to copper, which can cause warping or delamination during thermal cycling. To minimize CTE mismatches:

Use a symmetrical stack-up with balanced copper weights
Specify a low-CTE laminate like RO4360G2 for the core
Avoid large copper pours or use a thermal relief pattern
Employ a rigid bonding or prepreg layer between the laminate and copper

Careful material selection and stack-up design can help manage thermal expansion issues in Rogers PCBs.

5. What are the key challenges in assembling Rogers PCBs?

Assembling Rogers PCBs presents some unique challenges compared to standard FR-4, such as:

Poor solder mask adhesion to PTFE surfaces
Higher reflow temperatures required for lead-free assembly
Reduced thermal conductivity of PTFE affecting heat transfer
Potential moisture absorption and outgassing in vacuum

To overcome these challenges:

Use a compatible, high-temperature solder mask
Specify a HASL or ENIG surface finish for better solderability
Employ a metal core or thermal vias for enhanced heat dissipation
Bake the PCB prior to assembly to remove absorbed moisture

Proper assembly process control and material handling can ensure reliable and high-yield manufacturing of Rogers PCB assemblies.