Posts from October 31, 2024

What is a BGA Rework Station? A BGA rework station is a specialized machine used to remove and replace BGA components from printed circuit boards[…]

Introduction to Signal-Layer Bonding in 10 Layer PCBs Signal-layer bonding is a crucial process in the manufacturing of high-density, multi-layer printed circuit boards (PCBs), particularly[…]

Understanding the Supply Chain Crisis The supply chain crisis in the electronic manufacturing industry has been caused by a range of factors, including: Disruptions Caused[…]

What is BGA Soldering? BGA (Ball Grid Array) soldering is a process used to attach BGA components to printed circuit boards (PCBs). BGA components have[…]

Introduction to PCB Stackup A printed circuit board (PCB) is a crucial component in modern electronic devices, providing a platform for mounting and interconnecting electronic[…]

What is BGA PCB Assembly? BGA (Ball Grid Array) PCB (Printed Circuit Board) assembly is a process of attaching electronic components, particularly BGA packages, onto[…]

Introduction to Automotive PCBs Automotive Printed Circuit Boards (PCBs) are essential components in modern vehicles, playing a crucial role in enabling various electronic systems and[…]

Introduction to SMT and BGA Components Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted directly onto the[…]

What is Quick Turn PCB Assembly? Quick turn PCB assembly refers to the process of manufacturing PCBs in a short amount of time, typically within[…]

What is a TQFP Package? A Thin Quad Flat Pack (TQFP) is a surface-mount IC package with leads on all four sides. It has a[…]